LOCTITE ABLESTIK ABP 8060T Így ismerik: ABP 8060T (18G)
LOCTITE ABLESTIK ABP 8060T, BMI Hybrid, Die Attach
LOCTITE® ABLESTIK ABP 8060T is formulated to provide high heat transfer generated from power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity.
- Thermally conductive
- Hydrophobic
- Stable at high temperatures
- Electrically conductive
| Applications |
Die Attach |
| Coefficient of Thermal Expansion (CTE) |
55.0 ppm/°C |
| Cure Type |
Heat Cure |
| Extractable Ionic Content, Chloride (CI-) |
9.0 ppm |
| Extractable Ionic Content, Potassium (K+) |
9.0 ppm |
| Extractable Ionic Content, Sodium (Na+) |
9.0 ppm |
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