LOCTITE ABLESTIK ABP 8064T Így ismerik: ABLESTIK ABP 8064T (44G)
LOCTITE ABLESTIK ABP 8064T, Hybrid chemistry, Die Attach
LOCTITE® ABLESTIK ABP 8064T highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes.
- High thermal conductivity
- High electrical conductivity
- Medium modulus
- Low outgassing
| Applications |
Die Attach |
| Coefficient of Thermal Expansion (CTE) |
47.0 ppm/°C |
| Cure Type |
Heat Cure |
| Extractable Ionic Content, Chloride (CI-) |
9.0 ppm |
| Extractable Ionic Content, Potassium (K+) |
9.0 ppm |
| Extractable Ionic Content, Sodium (Na+) |
9.0 ppm |
| Hot Die Shear Strength |
5.6 psi |
| RT Die Shear Strength |
12.18 kg-f |
| Tensile Modulus, DMTA @ 250.0 °C |
1280.0 N/mm² (185505.0 psi ) |
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