LOCTITE ABLESTIK ATB 120U
LOCTITE ABLESTIK ATB 120U, Rubberized Epoxy, Die Attach
LOCTITE® ABLESTIK ATB 120U adhesive film is formulated for use in wafer lamination processes. It combines process ease with the proven reliability.
- Thin bondline
- Non-conductive
- Fast cure
- Excellent gap filling ability
| Adhesive Film Thickness |
20.0 µm |
| Carrier Film Thickness |
85.0 µm |
| Dicing Tape Diameter |
8.0 |
| Extractable Ionic Content, Chloride (CI-) |
10.0 ppm |
| Extractable Ionic Content, Fluoride (F-) |
10.0 ppm |
| Extractable Ionic Content, Potassium (K+) |
10.0 ppm |
| Extractable Ionic Content, Sodium (Na+) |
10.0 ppm |
| Hot Die Shear Strength |
2.0 kg-f |
| RT Die Shear Strength |
40.0 kg-f |
| Tensile Modulus, @ 250.0 °C |
2.0 N/mm² (230.0 psi ) |
| Wafer Diameter |
8.0 |
| Weight Loss, @ 300.0 °C |
<1.0 % |
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