LOCTITE ABLESTIK ATB 130
LOCTITE ABLESTIK ATB 130, Rubberized Epoxy, Die Attach
LOCTITE® ABLESTIK ATB 130 adhesive film is formulated for use in wafer lamination processess. It combines process ease with the proven reliability of a hybrid chemistry-based die attach material. LOCTITE ABLESTIK ATB 130 is pre-applied to a modified dicing tape for easy pick-up and one step lamination.
- Easy die pick up
- Excellent wettability
- One step lamination
- Excellent package reliability
| Adhesive Film Thickness |
30.0 µm |
| Carrier Film Thickness |
85.0 µm |
| Dicing Tape Diameter |
12.0 |
| Extractable Ionic Content, Chloride (CI-) |
10.0 ppm |
| Extractable Ionic Content, Potassium (K+) |
10.0 ppm |
| Extractable Ionic Content, Sodium (Na+) |
10.0 ppm |
| Hot Die Shear Strength |
2.0 kg-f |
| RT Die Shear Strength |
15.0 kg-f |
| Tensile Modulus, DMTA @ 250.0 °C |
8.6 N/mm² (1250.0 psi ) |
| Wafer Diameter |
12.0 |
| Weight Loss, @ 300.0 °C |
1.0 % |
HU
EN