LOCTITE ABLESTIK QMI2569

LOCTITE ABLESTIK QMI2569, Silver Glass, Semiconductor, Conductive Adhesive LOCTITE® ABLESTIK QMI2569 is a silver glass die attach adhesive used for attachment of integrated circuits in both solder seal glass seal hermetic packages. The material allows for simultaneous processing of die attach and leadframe embedding, while producing a void-free bondline for maximum thermal dissipation. Excellent RGA moisture results are acquired through the use of lead borate glass. LOCTITE ABLESTIK QMI2569 also offers improved processability by allowing in-line drying during the firing process on die as large as 0.800" x 0.800". Either multi-needle or starfish can be used to apply the material. LOCTITE ABLESTIK QMI2569 can only be used in hermetic packaging applications.

• Void-free bondline
• Maximum thermal dissipation

Color	Silver
Thixotropic Index	8.0
Viscosity	35800.0 mPa·s (cP)