Product details from catalogue Inquiry

Drawings:

LOCTITE ABLESTIK 8352L-G

LOCTITE ABLESTIK 8352L-G, Epoxy, Die Attach LOCTITE® ABLESTIK 8352L-G die attach adhesive is designed for high reliability packaging applications. This product is particularly suitable for packages in which tight control of resin bleed out or kerf creep is required.
  • Electrically conductive
  • Low stress
  • Use for wide range of package sizes
  • Excellent adhesion to copper

Applications Die Attach
Coefficient of Thermal Expansion (CTE) 76.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg 191.0 ppm/°C
Cure Type Heat Cure
Glass Transition Temperature (Tg) 31.0 °C
Thixotropic Index 5.7
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm 9430.0 mPa·s (cP)