LOCTITE ABLESTIK ABP 2450
LOCTITE ABLESTIK ABP 2450, BMI Hybrid, Heat cure
LOCTITE® ABLESTIK ABP 2450 die attach is formulated for use in high brightness LED manufacturing applications. This material is formulated to have a low moisture uptake and high light stability performance to extend LED lamp product life.
- High electrical conductivity
- Low moisture uptake
- Solvent-free
- Low halogen content
| Applications |
Die Attach |
| Coefficient of Thermal Expansion (CTE) |
61.0 ppm/°C |
| Coefficient of Thermal Expansion (CTE), Above Tg |
118.0 ppm/°C |
| Cure Type |
Heat Cure |
| Glass Transition Temperature (Tg) |
67.0 °C |
| Thixotropic Index |
5.5 |
| Viscosity, Brookfield DV-II, @ 25.0 °C Speed 5 rpm |
14000.0 mPa·s (cP) |
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