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LOCTITE ABLESTIK ATB F125E

LOCTITE ABLESTIK ATB F125E adhesive film is formulated for use in wafer lamination processes or as a preform decal. LOCTITE® ABLESTIK ATB F125E adhesive film is formulated for use in wafer lamination processes or as a preform decal.
  • Excellent workability
  • Ideal modulus for wide range of package sizes
  • Meets thin wafer requirements
  • High reliability

Adhesive Film Thickness 25.0 µm
Application Method Lamination
Applications Die Attach
Carrier Type Polyolefin
Color White
Cure Type Heat Cure, UV Cure
Dicing Tape Diameter 12.0
Extractable Ionic Content, Chloride (CI-) 19.0 ppm
Extractable Ionic Content, Potassium (K+) 1.0 ppm
Extractable Ionic Content, Sodium (Na+) 2.0 ppm
Hot Die Shear Strength, @ 260.0 °C 2.5 x 2.5 mm Si die on BT substrate 3.1 kg-f
Key Characteristics Work Life: Long Work Life
Moisture Absorption 0.78 %
Physical Form Film
Substrates Laminate
Technology Epoxy
Tensile Modulus, @ 250.0 °C 185.0 N/mm² (26831.0 psi )
Wafer Diameter 12.0
Weight Loss, TGA @ 200.0 °C 0.27 %