LOCTITE ABLESTIK NCA 2200

LOCTITE ABLESTIK NCA 2200, Acrylated Epoxy, Dual Cure, Assembly LOCTITE® ABLESTIK NCA 2200 dual cure adhesive is designed for use in the assembly of temperature sensitive electronic components This product is formulated to temporarily cure when exposed to UV light, followed with a secondary thermal cure at low temperature. Temporarily curing the material allows for any necessary adjustments to the final device configuration.

• Dual cure system
• Low viscosity
• Non-conductive
• Fast cure at low temperature
• Good adhesion to a variety of substrates

Cure Schedule Light Intensity	100.0 mW/cm²
Cure Schedule, Recommended	2.0 sec.
Cure Type	Heat + UV Cure
Number of Components	1 Part
Physical Form	Liquid
Storage Temperature	-20.0 °C
Substrates	Ceramic
Thixotropic Index	2.0
Viscosity, Cone & Plate, Cone 20 mm, Angle 2° @ 25.0 °C Shear Rate 20 s⁻¹	22000.0 mPa·s (cP)