LOCTITE ECCOBOND FP0087
LOCTITE ECCOBOND FP0087 is a single component, epoxy based encapsulant for potting stress sensitive devices.
LOCTITE® ECCOBOND FP0087 is a single component potting product with low thermal expansion. This product therefore provides excellent thermal shock resistance and reduced warpage and cracking.The unique combination of low stress and excellent resistance to moisture and process fluids provide excellent results in severe automotive environments.
- Single component
- Excellent thermal shock resistance
- Excellent moisture resistance
- High glass transition
| Applications |
Encapsulating |
| Coefficient of Thermal Expansion (CTE), Below Tg |
18.0 ppm/°C |
| Color |
Black |
| Cure Type |
Heat Cure |
| Number of Components |
1 Part |
| Shelf Life |
9.0 mon. |
| Shore Hardness, Shore D |
95.0 |
| Technology |
Epoxy |
| Viscosity, Brookfield - RVF, @ 25.0 °C Spindle 6, speed 20 rpm |
20000.0 mPa·s (cP) |
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