LOCTITE ECCOBOND FP4450

LOCTITE ECCOBOND FP4450, Epoxy, Encapsulant LOCTITE® ECCOBOND FP4450 encapsulant is designed for protection of bare semiconductor devices. It offers pressure pot performance on live devices up to 500 hours with no failures, depending upon the device and package type. A cavity or potting dam is required for flow control. Please refer to the TDS for alternate cure schedules.

• Low stress
• Good moisture resistance
• High purity
• Exhibits relatively high flow

Coefficient of Thermal Expansion (CTE), Below Tg	22.0 ppm/°C
Color	Black
Cure Schedule, Alternate @ 165.0 °C	90.0 min.
Cure Schedule, Recommended @ 125.0 °C	30.0 min.
Cure Type	Heat Cure
Filler	73.0 %
Glass Transition Temperature (Tg)	155.0 °C
Operating Temperature	-65.0 - 150.0 °C
Specific Gravity, @ 25.0 °C	1.77
Storage Temperature	-40.0 °C
Viscosity, Brookfield - RVT, @ 25.0 °C Spindle 7, speed 20 rpm	43900.0 mPa·s (cP)