LOCTITE ECCOBOND FP4460

LOCTITE ECCOBOND FP4460, Epoxy, Encapsulant - glob top LOCTITE® ECCOBOND FP4460 encapsulant is designed for protection of bare semiconductor devices. Pressure pot performance on live devices is up to 500 hours with no failures, depending on device and package type.

• Low stress
• High purity
• Improved work life
• High temperature performance

Coefficient of Thermal Expansion (CTE), Below Tg	20.0 ppm/°C
Color	Black
Cure Schedule, @ 150.0 °C	3.0 hr.
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	173.0 °C
Operating Temperature	-65.0 - 150.0 °C
Specific Gravity, @ 25.0 °C	1.78
Viscosity, Brookfield - RVF, @ 25.0 °C Spindle 7, speed 10 rpm	300000.0 mPa·s (cP)