LOCTITE ECCOBOND LA 3032-78
LOCTITE ECCOBOND LA 3032-78, Chemically resistant, Epoxy, Encapsulant
LOCTITE® ECCOBOND LA 3032-78 encapsulant is designed for high throughput assembly operations. It is formulated to withstand high heat distortion temperatures and bonds well to engineering plastics
- One component
- Fast cure at low temperatures
- Excellent chemical resistance
| Casson Viscosity, Cone diameter 2 cm, Angle 2° Shear Rate 50 s⁻¹ |
500000.0 mPa·s (cP) |
| Cure Schedule, @ 100.0 °C |
15.0 min. |
| Cure Schedule, @ 120.0 °C |
3.0 min. |
| Glass Transition Temperature (Tg) |
110.0 °C |
| Storage Modulus, @ 25.0 °C Ramp Rate 3 °C/min., 1 Hz, 10μm |
3700.0 N/mm² (536639.0 psi ) |
| Thixotropic Index |
6.5 |
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