LOCTITE ABLESTIK 550 Így ismerik: Ablestik ABLEFILM 550
LOCTITE ABLESTIK 550, Epoxy Film, Assembly
LOCTITE® ABLESTIK 550 adhesive film is designed for substrate attach and sealing microelectronic packages. This adhesive film gives off methanol, water, and ammonia during cure. Using LOCTITE ABLESTIK 550 adhesive in hermetically sealed packages is not recommended.
| Cure Schedule, @ 150.0 °C |
30.0 min. |
| Cure Type |
Heat Cure |
| Dielectric Constant, @ 1kHz |
4.8 |
| Glass Transition Temperature (Tg) |
105.0 °C |
| Physical Form |
Film |
| Shear Strength, Aluminum |
5700.0 psi |
| Technology |
Epoxy |
| Thermal Conductivity |
0.2 W/mK |
HU
EN