LOCTITE ABLESTIK 563K Így ismerik: Ablestik ABLEFILM 563K

LOCTITE ABLESTIK 563K, Epoxy Film, Assembly LOCTITE® ABLESTIK 563K adhesive film is suitable for bonding "hot" devices onto heat sinks where electrical insulation and good heat transfer are required. It exhibits low squeeze out during bonding. This product provides high strength over a wider temperature range than is normally associated with flexible films.

• Thin bondline
• High strength film with high thermal conductivity
• Good heat transfer
• Uniform bondline control

Cure Schedule, @ 150.0 °C	30.0 min.
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	97.0 °C
Physical Form	Film
Shear Strength, Aluminum	3000.0 psi
Technology	Epoxy
Thermal Conductivity	1.1 W/mK