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LOCTITE ABLESTIK ATB 130U Így ismerik: EASY STACK ATB-130U-12

LOCTITE ABLESTIK ATB 130U adhesive film is formulated for use in wafer lamination processes. It combines process ease with the proven reliability. LOCTITE® ABLESTIK ATB 130U adhesive film is formulated for use in wafer lamination processes. It combines process ease with the proven reliability.
  • Non-conductive
  • Excellent gap filling ability
  • Thin bondline
  • L2/260°C performance

Adhesive Film Thickness 30.0 µm
Carrier Film Thickness 85.0 µm
Dicing Tape Diameter 12.0
Extractable Ionic Content, Chloride (CI-) 10.0 ppm
Extractable Ionic Content, Fluoride (F-) 10.0 ppm
Extractable Ionic Content, Potassium (K+) 10.0 ppm
Extractable Ionic Content, Sodium (Na+) 10.0 ppm
Hot Die Shear Strength 2.0 kg-f
RT Die Shear Strength 40.0 kg-f
Tensile Modulus, @ 250.0 °C 2.0 N/mm² (230.0 psi )
Wafer Diameter 12.0
Weight Loss, @ 300.0 °C <1.0 %