LOCTITE ABLESTIK 8008HT Így ismerik: ABLECOAT 8008HT

LOCTITE ABLESTIK 8008HT, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 8008HT adhesive is designed for high power devices in high UPH environment. It offers a lead-free alternative to soft solder and eutectic and can potentially reduce the layers of backside metallization required. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. The adhesive can then be cured after die attach in an in-line process exhibiting a consistent, void-free bondline without bleed. LOCTITE ABLESTIK 8008HT should be used with a pressure sensitive dicing tape and is not compatible with UV dicing tapes.

• Electrically conductive
• Thermally conductive
• Snap curable after B-stage
• Low modulus

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	37.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	62.0 ppm/°C
Color	Silver
Cure Schedule, Snap Cure @ 170.0 °C	20.0 sec.
Cure Type	Heat Cure
Extractable Ionic Content, Chloride (CI-)	9.0 ppm
Extractable Ionic Content, Potassium (K+)	9.0 ppm
Extractable Ionic Content, Sodium (Na+)	9.0 ppm
Glass Transition Temperature (Tg)	264.0 °C
Hot Die Shear Strength, @ 260.0 °C 2 x 2 mm Si die on Cu LF	2.6 kg-f
RT Die Shear Strength, 2 x 2 mm Si die on Cu leadframe	6.0 kg-f
Tensile Modulus, @ 250.0 °C	2451.0 N/mm² (355340.0 psi )
Thermal Conductivity	11.0 W/mK
Thixotropic Index	4.0
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	50000.0 mPa·s (cP)
Volume Resistivity	0.00005 Ohm cm