BERGQUIST GAP PAD TGP 2000 Így ismerik: Gap Pad® 2000S40
BERGQUIST GAP PAD TGP 2000 is a silicone based, highly conformable, thermally conductive, reinforced “S-Class” gap filling material.
BERGQUIST® GAP PAD TGP 2000 is recommended for low-stress applications that require a mid to high thermally conductive interface material. The highly conformable nature of the material allows the pad to fill in air voids and air gaps with stepped topography, rough surfaces and high stack-up tolerances.It is offered with inherent natural tack on both sides of the material allowing for stickin-place characteristics during application assembly
- Thermal Conductivity: 2.0 W/m-K
- Low “S-Class” thermal resistance at very low pressures
- Designed for low-stress applications
- Highly Conformable, low hardness
| Color |
Gray |
| Density |
2.9 g/cm³ |
| Dielectric Breakdown Voltage |
5000.0 Vac |
| Dielectric Constant, @ 1kHz |
6.0 |
| Flame Rating |
V-0 |
| Heat Capacity, ASTM E1269 |
0.6 J/g-K |
| Operating Temperature |
-60.0 - 200.0 °C |
| Shore Hardness, Thirty second delay value, ASTM D2240 Bulk Rubber Shore 00 |
30.0 |
| Standard Thickness |
0.508 - 3.175 mm |
| Thermal Conductivity |
2.0 W/mK |
| Volume Resistivity |
1×10 Ohm m |
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