BERGQUIST GAP PAD TGP 2700 Így ismerik: Gap Pad® 2500

BERGQUIST GAP PAD TGP 2700, Thermally Conductive, Un-Reinforced Gap Filling Material BERGQUIST® GAP PAD TGP 2700 is a thermally conductive, electrically insulating, un-reinforced gap filling material. The fiberglass reinforcement allows for easy material handling and enhances puncture, shear and tear resistance. BERGQUIST GAP PAD TGP 2700 is a filled-polymer material yielding an elastic polymer that allows for easy handling and converting without the need for reinforcement. These properties also allow for good wet-out and interfacing characteristics to surfaces with roughness and/or topography. All these characteristics make this material ideal for applications using either clip or screwmounted assemblies. BERGQUIST GAP PAD TGP 2700 is offered with inherent natural tack on both sides of the material allowing for stickin-place characteristics during application assembly. The material is supplied with protective liners on both sides.

• Thermal Conductivity: 2.7 W/m-K
• High thermal performance, cost-effective solution
• Un-reinforced construction for additional compliancy
• Medium compliancy and conformability

Color	Light Brown
Operating Temperature	-60.0 - 200.0 °C
Standard Thickness	0.508 - 3.175 mm
Technology	Silicone
Thermal Conductivity	2.7 W/mK