BERGQUIST GAP PAD TGP 3000 Így ismerik: Gap Pad® 3000S30

BERGQUIST GAP PAD TGP 3000 is a thermally conductive,reinforced and Soft “S-Class” Gap Filler for low stress sensitive applications. BERGQUIST® GAP PAD TGP 3000 is a pre-cured silicone based, thermally conductive, reinforced gap pad. This product is highly conformable and exhibits S class thermal resistance and softness. It is fiberglass reinforced and therefore offers resistance against puncture, shear and tear.It is also UL-94 V-0 compliant. This product is well suited for high performance, low stress sensitive applications.

• Thermal conductivity: 3.0 W/m-K
• Low "S-Class" thermal resistance at very low pressures
• Highly conformable,"S-Class" softness
• Designed for low-stress applications

Color	Light Blue
Density	3.2 g/cm³
Dielectric Breakdown Voltage	3000.0 Vac
Dielectric Constant, ASTM D150 @ 1kHz	7.0
Flame Rating	V-0
Heat Capacity, ASTM E1269	1.0 J/g-K
Operating Temperature	-60.0 - 200.0 °C
Shore Hardness, Thirty second delay value, ASTM D2240 Bulk Rubber Shore 00	30.0
Standard Thickness	0.254 - 3.175 mm
Volume Resistivity	1×10 Ohm m