BERGQUIST GAP PAD TGP 3004SF Így ismerik: Gap Pad® 3004SF
BERGQUIST GAP PAD TGP 3004SF is a high perfromance, silicone free, thermally conductive gap pad ideal for silicone sensitive applications.
BERGQUIST® GAP PAD TGP 3004SF is a silicone free, thermally conductive gap pad. This product exhibits excellent thermal performance and thereby offers exceptionally low interfacial resistance to adjacent surfaces.This product has no silicone content and is therefore ideal for silicone sensitive applications.
- Thermal conductivity: 3 W/m-K
- Silicone free
- UL94 V-0 compliance
- Reworkable
| Carrier Type |
0.25 mil PET Film |
| Color |
Light Gray |
| Density, Maximum Final |
3.2 g/cm³ |
| Flame Rating |
V-0 |
| Operating Temperature |
-40.0 - 125.0 °C |
| Shore Hardness, Thirty second delay value, ASTM D2240 Bulk Rubber @ 23.0 °C Shore 00 |
70.0 |
| Standard Thickness |
0.254 - 3.715 mm |
| Thermal Conductivity |
3.0 W/mK |
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