BERGQUIST GAP PAD TGP HC3000 Így ismerik: Gap Pad® HC 3.0

BERGQUIST GAP PAD TGP HC3000 is a soft and compliant, high performance gap pad filler with a thermal conductivity of 3.0 W/m-K. BERGQUIST® GAP PAD TGP HC3000 is designed with a unique filler package and low modulus material to provide exceptional thermal performance at low pressures. The highly conforming material provides excellent wet-out characteristics at the interface of rough and irregular surfaces and is ideal for fragile applications that require low stress on components and boards during assembly.

• Thermal conductivity: 3.0 W/m-K
• High-compliance, low compression stress
• Fiberglass reinforced for shear and tear resistance

Carrier Type	Fiberglass
Color	Blue
Flame Rating	V-0
Operating Temperature	-60.0 - 200.0 °C
Standard Thickness	0.508 - 3.175 mm
Technology	Silicone
Thermal Conductivity	3.0 W/mK
Young's Modulus, ASTM D575	110.0 KPa (16.0 psi )