BERGQUIST LIQUI FORM TLF 4500CGEL-SF

BERGQUIST LIQUI FORM TLF 4500CGEL-SF is a 4.5 W/mK one part, silicone-free thermally conductive curable gel with high performance for automotive electronics sensors and control units BERGQUIST® LIQUI FORM TLF 4500CGEL-SF is a 4.5 W/mK one part, high performance, thermally conductive, silicone-free, room temperature curable gel designed for demanding high reliability applications. Curing (skin formation) can be accelerated with heat. As cured, BERGQUIST LIQUI FORM TLF 4500CGEL-SF provides a soft, thermally conductive, form-in place elastomer that is ideal for fragile assemblies, capable of filling unique and intricate air voids and gaps. It is ideal for applications where highly reliable vertical gap stability is required.

• Innovative 1-component solution that cures in place for enhanced vertical gap stability*
• Excellent handling properties & very fast dispensing speed
• Silicone-free technology passing hazing and fogging tests optimized for optical systems
• High thermal conductivity, temperature reliability & low assembly stress rheology