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LOCTITE ABLESTIK 84-3J

LOCTITE ABLESTIK 84-3J, Epoxy, Die Attach LOCTITE® ABLESTIK 84-3J adhesive is designed for die attach applications as well as component attach. The use of this material as a staking compound under chip components help eliminate shorting due to the capillary action of conductive adhesives. Please refer to the TDS for alternate cure schedules.
  • Electrically Insulating
  • Engineered for accurate bondline control
  • One component
  • Long work life

Applications Die Attach
Coefficient of Thermal Expansion (CTE) 41.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg 112.0 ppm/°C
Cure Type Heat Cure
Extractable Ionic Content, Chloride (CI-) 10.0 ppm
Extractable Ionic Content, Potassium (K+) 20.0 ppm
Extractable Ionic Content, Sodium (Na+) 5.0 ppm
Glass Transition Temperature (Tg) 87.0 °C
RT Die Shear Strength 21.0 kg-f
Tensile Modulus, @ 250.0 °C 172.0 N/mm² (25000.0 psi )
Thermal Conductivity 0.5 W/mK
Thixotropic Index 2.5
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm 20000.0 mPa·s (cP)