LOCTITE ECCOBOND FP4531

LOCTITE ECCOBOND FP4531 underfill is designed for flip chip on flex applications with a 1mil gap. LOCTITE ECCOBOND FP4531 underfill is designed for flip chip on flex applications with a 1mil gap.

• Snap curable
• Fast flow
• Passes NASA outgassing

Flexural Modulus

7600.0 N/mm² (1102000.0 psi )