LOCTITE ABLESTIK ABP 2032S Így ismerik: ABP 2032S (17G)
LOCTITE ABLESTIK ABP 2032S, Epoxy, Die Attach, Electrically Conductive Adhesive
LOCTITE® ABLESTIK ABP 2032S electrically conductive adhesive is designed as a Pb-free alternative to solder. It cures quickly at low temperatures for good stress control in large die size package applications.
- Good adhesion
- Low temperature cure
- Electrically conductive
- Good dispensing characteristics
| Applications |
Die Attach |
| Coefficient of Thermal Expansion (CTE) |
54.0 ppm/°C |
| Cure Type |
Heat Cure |
| Extractable Ionic Content, Chloride (CI-) |
29.0 ppm |
| Extractable Ionic Content, Potassium (K+) |
19.0 ppm |
| Extractable Ionic Content, Sodium (Na+) |
19.0 ppm |
| RT Die Shear Strength |
16.0 kg-f |
| Substrates |
LeadFrame: Gold |
| Tensile Modulus, DMA @ 250.0 °C |
150.0 N/mm² (21755.0 psi ) |
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